14.E5.T60-1061 KEB
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The KEB 14.E5.T60-1061 is an EMC filter from the Combiline EMC Filters series. It supports 3 input phases and operates at a voltage class of 460 V with a current rating of 22 Amps. The filter has a conductor cross-section of 4 mm² and a leakage current of 4.5 mA, weighing 1.5 kg and measuring 285 mm in height, 90 mm in width, and 50 mm in depth.
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Product Description:
The 14.E5.T60-1061 is a three-phase electromagnetic compatibility filter produced by KEB for the Combiline EMC Filters series. Positioned at the input of variable-frequency drives and other power converters, the component suppresses conducted noise that would otherwise travel along motor and power lines. By limiting high-frequency interference, the filter helps production machinery satisfy industrial EMC standards and prevents neighboring control circuits from being disturbed during switching operations.
It carries a maximum continuous line current of 22 A, so it is suitable for midrange inverters whose full-load demand does not exceed that value. The unit belongs to the 460 V voltage class, matching common North American three-phase power systems. Internal power dissipation is limited to 14 W at nominal load, and cabinet airflow must remove this heat to keep the capacitors within their operating temperature range. Leakage current to protective ground is limited to 4.5 mA, allowing compatible residual-current devices to remain selective. The terminals accept power conductors with cross-sectional areas up to 4 mm², and the design supports three input phases with neutral bonding. Its EMC performance meets category B requirements for cable runs up to 10 m. Appropriate grounding and conductor routing help maintain the intended attenuation of high-frequency electrical noise.
The housing measures 90 mm wide, 50 mm deep, and 285 mm high, providing a tall, narrow profile that fits beside contactors without blocking ventilation paths. The filter weighs 1.5 kg, so it can be secured on a DIN rail or mounted directly on a subplate without additional bracing. It uses substructure housing type D, with mounting slots and a grounding stud pattern shared across the product family. When installed inside an enclosure, the device requires sufficient space at the front for conductor bends and minimum clearance from adjacent live parts.
