S20-AI-8 Bosch Rexroth Indramat
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MPN: R911172536
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The Bosch Rexroth Indramat S20-AI-8 is part of the S20 IndraControl Modules series and provides 8 input channels. It supports shielded twisted pair cables up to 1.5 mm² and uses a push-in connection method. The module has a max contact load of 8 Amps and is rated IP20 for protection.
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Product Description:
Bosch Rexroth Indramat manufactures the S20-AI-8 analog input module within the S20 IndraControl Modules series. This component collects process voltages and currents and forwards them to an IndraControl automation controller, allowing distributed acquisition of sensor data on machine lines. The module mounts on the S20 bus alongside digital and motion nodes, providing a unified I/O platform without requiring a separate connection system.
The I/O carrier presents a push-in spring cage so field wiring can be completed without tools; its contacts accept conductors with a maximum cross-sectional area of 1.5 mm² after they are trimmed to a strip length of 8 mm. Eight individually scanned input circuits are arranged in a single terminal field, providing an input count of 8 channels that share the module’s UA sensor supply. The plastic enclosure measures 53.6 mm wide along the DIN rail, rises to a height of 126.1 mm, and extends to a depth of 54 mm within the cabinet, conserving panel space. The module has an IP20 protection rating when it is mounted inside a closed control panel, where the enclosure prevents accidental contact with hazardous internal parts.
The housing has a Type 2 rating and receives power from the backplane’s UA line, so it does not require a separate auxiliary voltage source. Each channel’s sensing electronics draws only milliamps, while the common spring block supports a maximum contact load of 8 A without excessive heating. Installation must account for a maximum operating altitude of 3000 m, above which insulation distances may require derating. To reduce electromagnetic interference on long cable runs, the module requires shielded twisted-pair cable between the transducers and push-in headers. This wiring arrangement helps preserve analog signal integrity and keeps the conductors securely clamped when the module is exposed to normal machine vibration.