X20cDI9371 B & R Automation
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The X20cDI9371 is a digital input module manufactured by B & R Automation as part of the X20 Fieldbus Input Output Modules series. It provides 12 sink logic digital inputs and operates at a nominal input voltage of 24 VDC. The module has a bus power consumption of 0.18 W and a maximum operating humidity of 100%.
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Product Description:
The X20cDI9371 is a digital input module manufactured by B & R Automation for the X20 Fieldbus Input Output Modules series. It mounts on an X20 backplane and accepts binary sensor signals, passing their states to the controller through real-time fieldbus communication. Within a distributed automation system, the unit converts switch states from field devices into data that the CPU can process, allowing compact expansion of machine input capacity without requiring a separate interface for each connected sensor.
The module operates with a nominal input voltage of 24 VDC, aligning with standard industrial sensor supply rails. It offers 12 individually isolated channels, and each channel follows sink logic, so connected field devices must source current to the inputs. Overall power consumption from the X20 system bus is 0.18 W, which limits the module’s contribution to the electrical load on the backplane. The status LEDs and input circuitry require an additional 1.75 W of internal input/output power. These power values help determine cabinet heat dissipation and system power requirements when all channels are active. Channel isolation also helps prevent an electrical disturbance on one field connection from affecting the signals received through the other inputs.
The module provides 0.00 W of sensor power output, so an external voltage source must energize connected sensors and switches. It supports continuous operation at up to 100% relative humidity, allowing use in locations where moisture levels may remain high for extended periods. The electronics also support condensing operation, making the module suitable for washdown areas or climate-controlled chambers where condensation may form after temperature changes. Its compact housing uses a backplane connector that supports tool-free insertion into the X20 system. This connection method allows the module to be installed without modifying the communication path between adjacent modules. Field wiring can remain organized at the terminal assembly while the input module is inserted or removed from the backplane.
