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X20BM32 B & R Automation

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The X20BM32 bus module is manufactured by B & R Automation and is part of the X20 Fieldbus Input Output Modules series. It features a double-width design with 12 terminal positions and supports a keying voltage of 240 VAC. The module uses a push-in connection system, has a max operating elevation of 2000 meters, and allows for 50 mating cycles.

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Product Description:

The X20BM32 is a bus module manufactured by B&R Automation for the X20 Fieldbus Input Output Modules series. It forms the physical interface between the backplane and the field I/O slices, carrying communication paths and supply lines across the station. This arrangement allows distributed nodes to be mounted directly on a DIN rail without separate interconnect wiring. Because the module passes bus and supply continuity from one slice to the next, a station can be expanded in a linear arrangement without loose jumpers between adjoining units. This supports orderly module grouping when digital, analog, and communication slices share the same node. Its role suits industrial automation networks that need a compact layout and hot-swappable module connectivity.

It draws only 0.13 W of bus power, which helps limit added heat inside crowded control cabinets. Field wiring enters through a Push-In connection system, allowing toolless insertion of ferrule-terminated conductors. The housing uses a Double-Width format, so it occupies two standard X20 slots while maintaining the internal I/O power path to the next slice. The keying element is rated for 240 VAC, supporting correct module pairing in mixed-voltage assemblies. Twelve spring terminals are arranged in two rows, giving 12 connection positions for signal or auxiliary lines. A mating durability of 50 cycles and support for twin sleeves up to 2 × 0.75 mm² allow repeated reconnection and straightforward daisy-chain routing where compact wiring is needed.

The module has a depth of 75 mm behind the rail and a height of 99 mm, matching the profile of adjacent X20 components for flush alignment. Operation is permitted up to 2000 m elevation, so most indoor industrial sites do not require altitude-related derating. Humidity tolerance reaches 95% RH without condensation, supporting stable use in damp production areas. The molded enclosure routes fieldbus shielding to earth and keeps the twin-sleeve clamp accessible from the front, which supports orderly cable routing in dense panels. Front access to the clamping area helps preserve reachability after neighboring slices are installed, which is useful where available cabinet depth is limited.

Bus Power Consumption
0.13 W
Connection System
Push-In
Depth
75 mm
Height
99 mm
I/o Power Path
Connected Through
Keying Voltage
240 VAC
Mating Cycles
50
Max Operating Elevation
2000 m
Max Relative Humidity
95% RH
Module Type
Bus Module
Module Width
Double-Width
Terminal Positions
12
Twin Sleeve Capacity
2x 0.75 mm²

Frequently Asked Questions about X20BM32:

Q: What is the bus power consumption of the X20BM32 module?

A: The X20BM32 bus module has a bus power consumption of 0.13 W during operation.

Q: What type of connection system does the X20BM32 use?

A: A push-in connection system is provided with the X20BM32 for quick and secure wiring.

Q: What is the module width of the X20BM32 bus module?

A: The X20BM32 features a double-width module design for expanded installation.

Q: What keying voltage is supported by the X20BM32?

A: This module is rated for keying voltages up to 240 VAC to prevent incorrect module insertion.

Q: How many terminal positions does the X20BM32 provide?

A: The X20BM32 offers 12 terminal positions for flexible wiring options.


Internal Product Review

  • ‘‘The X20BM32 is a B & R Automation bus module with a Push-In connection system and a connected-through I/O power path. Low 0.13 W bus power consumption and a double-width format make the module especially efficient and practical for streamlined control cabinets. A 240 VAC keying voltage adds secure module assignment, making the X20BM32 a strong choice for dependable fieldbus integration.’’

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