X20BC0087 B & R Automation
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The X20BC0087 is a fieldbus input output module from B & R Automation and is part of the X20 Fieldbus Input Output Modules series. It supports a supply voltage of 24 VDC and features a 2-port integrated switch with two RJ45 ports. The module accommodates Modbus/TCP and Modbus/UDP protocols, and it measures 37.5 mm in width, 75 mm in depth, and 99 mm in height.
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Product Description:
B & R Automation manufactures the X20BC0087 bus controller for its X20 Fieldbus Input Output Modules series. The unit serves as the network head of an X20 I/O node, translating internal X2X backplane traffic to Ethernet so that standard automation controllers can read and write field signals. In a control cabinet it is installed to provide deterministic communication between distributed sensors, actuators, and supervisory PLCs by means of the Modbus protocol family. Because the controller has its own integrated power rails, it simplifies wiring for compact machines.
The communication side is powered from the system bus with a nominal supply of 24 VDC, removing the need for an external drop cable for electronics. Two front-face Ethernet sockets use the standard RJ45 connector, and an internal 2-port switch allows line topology so additional stations can be daisy-chained without a separate hub. The module supports Modbus/TCP and Modbus/UDP; both frame types are accepted on the same interface in cyclic or acyclic mode. Only 1 interface is present, which means all telegrams share the same physical link, easing address management. The I/O supply is integrated, and the X2X supply is also integrated, so all connected slice modules receive logic and sensor power directly through the backplane.
Mechanically, the housing is 37.5 mm wide, 99 mm high, and 75 mm deep, so it occupies a single slot on the standard X20 DIN-rail carrier without blocking adjacent modules. The front panel exposes 2 RJ45 ports that mirror the switch inside and keep IP20 accessibility behind the cabinet door. Tight packaging is possible because the depth stays within the reach of terminal blocks, and wiring from the top leaves clearance for ventilation channels. When combined with other I/O slices of identical height, the uniform profile simplifies heat flow calculations and cable routing along the panel.