5PC900.TS77-01 B & R Automation
Wake Industrial LLC is not an authorized distributor of this product.
The B & R Automation 5PC900.TS77-01 is part of the 5PC Industrial Automation Units series and features an Intel Core i7-3612QE processor running at 2100 MHz with a 6 MB smart cache and four cores. It comes equipped with an Intel HD Graphics 4000 controller, supports up to 16 GB DDR3 memory, and offers four SATA storage interfaces. The unit also includes a 32-bit color depth, DisplayPort 1.1, and can reach a maximum DVI resolution of 1920 x 1200 WUXGA.
Internal Product Review
The 5PC900.TS77-01 is an industrial automation unit built around an Intel Core i7-3612QE processor with a 4-core architecture. Intel HD Graphics 4000 and 32-bit color depth support clear visualization for demanding HMI workloads. Support for up to 16 GB DDR3 memory gives the platform strong multitasking headroom.
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Product Description:
The 5PC900.TS77-01 industrial PC is produced by B & R Automation within the 5PC Industrial Automation Units series. This panel-mount computing module operates as the central control layer in automated production lines, collecting field data, executing deterministic logic, and forwarding instructions to motion drives and I/O nodes. By integrating CPU, graphics, and storage interfaces in a single enclosure, the unit replaces separate controller racks with a compact, maintenance-friendly platform suitable for continuous plant service.
The processing core is built around an Intel QM77 chipset that supports virtualization and high-bandwidth peripheral buses for deterministic field networking. Its Intel Core i7-3612QE runs at a base frequency of 2100 MHz, and the quad-core architecture uses 4 cores to allow simultaneous execution of PLC, HMI, and data-logging tasks. Integrated graphics are provided by the Intel HD Graphics 4000 engine, which drives real-time process visualization and supports an external DisplayPort 1.1 output while sustaining a maximum graphics clock of 1 GHz. System RAM is expandable up to 16 GB, enabling large recipe buffers and soft-safety runtimes without swapping delays.
Application throughput is further supported by dual-channel memory configured with DDR3 modules, which balance latency and power consumption. The processor die is fabricated on a 22 nm process node, so switching losses remain low even during peak cyclic loads. The platform maintains a thermal design envelope of 35 W, allowing the system to use convection or modest forced-air cooling rather than elaborate liquid loops. Four SATA ports remain available for solid-state or rotating media, facilitating segmented boot, historian, and backup volumes while keeping the front panel uncluttered.
