5AC901.HS00-00 B & R Automation
Wake Industrial LLC is not an authorized distributor of this product.
The 5AC901.HS00-00 is an addon module from the 5AC CNC Addon Modules series by B & R Automation. It supports Celeron and Core i3, i5, and i7 CPUs on HM76 and QM77 chipsets, with CPU clock speeds ranging from 1.1 GHz to 2.7 GHz. The module features active cooling with cooling fins and heat pipes and is designed for use at ambient temperatures up to 55°C.
Internal Product Review
The 5AC901.HS00-00 is a B & R Automation 5AC CNC addon cooling module designed for active cooling with heat pipes. Compatibility with HM76 and QM77 chipsets makes integration straightforward across Celeron and Core i3/i5/i7 CPU families. Strong thermal design supports non-condensing operation up to 55 °C.
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Product Description:
The 5AC901.HS00-00 is an add-on computing module produced by B&R Automation for the 5AC CNC Addon Modules series. Installed beside the motion and I/O cards of the host industrial PC, the board supplies additional processor resources for tool-path interpolation, axis coordination, and PLC tasks within a single enclosure. It operates as a plug-in companion rather than a standalone controller, depending on the host system for backplane power, program storage, and fieldbus communication. This arrangement keeps motion control and auxiliary logic in the same hardware platform without requiring a separate external controller.
The board works with Intel mobile chipsets HM76 and QM77, enabling the use of Celeron, Core i3, Core i5, or Core i7 CPUs. Minimum sustained frequency is 1.1 GHz, and turbo operation can reach 2.7 GHz when thermal conditions allow it. Architectures with 1, 2, or 4 physical cores are supported, giving flexibility between single-thread determinism and parallel execution. Because the operating environment must remain non-condensing, cabinet climate control must prevent moisture accumulation. Cooling fins, integral heat pipes, and an active blower are mandatory, and the accompanying fan kit is required to protect silicon junction temperature during prolonged contouring cycles. This processor range allows the host platform to handle anything from basic machine logic to more demanding multi-axis motion workloads.
The maximum ambient temperature is 55 °C at a reference altitude of 500 m; beyond that height, the allowable maximum decreases by 1 °C/1000 m. The design accommodates up to 11 CPU boards inside a single automation frame, allowing separate machining channels to run on independent processors. Mechanical integration is possible in 1-slot, 2-slot, or 5-slot base units, and the thermal budget is supported by the module’s Active cooling concept, where heat pipes move waste energy to an external fin stack kept in motion by a dedicated axial fan. This layout supports dense control configurations while keeping heat removal tied directly to the module assembly.
