Product Description:

The 5AC801.HS00-01 is a passive heat sink produced by B&R Automation as part of the 5AC CNC Addon Modules series. It attaches to dedicated controller backplanes to draw heat away from embedded CPUs in computer numerical control systems that run continuous motion workloads. By providing a large fin surface and embedded heat pipes, the unit stabilizes junction temperature and helps protect processing boards from thermal throttling during extended operation. Because it is passive, the module relies on surface area and thermal conduction rather than a powered cooling device at the mounting point. The module is specifically intended to accompany 5PC800-class CPU boards used in high-speed path interpolation.

An extruded body made of aluminum gives the heat sink a favorable strength-to-weight ratio and high thermal conductivity. The profile is machined to a depth of 28 mm, spans 228.7 mm in width, and reaches 218 mm in height, dimensions that match the clearance envelope of the 800-series control cabinet. Its size also provides broad contact coverage over the mating surface of the carrier assembly. The exterior has a black coating, which promotes radiative heat loss and helps guard the metal against oxidation. These physical characteristics affect how quickly the part absorbs and releases heat in convection-cooled enclosures.

Thermal energy collected at the base is transported through internal channels that contain copper heat pipes, allowing localized hot spots on the processor package to be leveled across the fin stack. The sink mounts directly onto the 5AC carrier plates that hold 5PC800.B945-04/-14 and 5PC800.BM45-00/-01 CPU boards. Those boards use a dual-core architecture and can be fitted with Intel mobile processors such as T7400, T9400, and P8400, whose 45 W thermal design power matches the dissipation capacity of this module. This combination supports steady heat transfer during sustained CNC execution and helps the controller maintain stable processing performance.