E4809-770-018-B Okuma
Wake Industrial LLC is not an authorized distributor of this product.
The E4809-770-018-B board ensures efficient processing with a 12 MHz HD68HC000P12 CPU and dual 8KB HM6264LP-10 SRAM chips. The integrated ALS logic chips enhance control logic and power efficiency.
Internal Product Review
The Okuma E4809-770-018-B SVP board excels with its Hitachi HD68HC000P12 processor, 100 ns SRAM access, and advanced ALS/AS logic chips. The custom ICs enable precise signal processing while TDK components ensure filtering stability. This board is a reliable industrial control unit built for demanding automation environments.
To contact sales for pricing and lead time:
Payment Methods
Shipping Methods
Our Credentials
Product Description:
The E4809-770-018-B SVP Board is an embedded control unit designed for industrial systems. It is engineered for reliable signal processing and system interfacing. The board integrates core CPU processing, memory storage, logic circuits and proprietary signal handling in a compact module. Its configuration allows direct backplane installation via a standard edge connector.
The Okuma E4809-770-018-B SVP board is equipped with a Hitachi HD68HC000P12 microprocessor. This CPU supports 16/32-bit processing and operates at a clock speed of 12 MHz that enables efficient data handling and control logic execution. Memory resources include two HM6264LP-10 static RAM chips each providing 8 KB x 8 bit low power CMOS SRAM with 100 ns access time. Firmware storage of this model is managed by three 32 KB EPROMs SVPC501BU, SVPC501BL and SVPC501AL. These chips retain system instructions and boot-level software. The board features multiple custom integrated circuits: OCL502 ENCD for encoder input, OCL501A SAMP for signal sampling and OCL501 SENS for sensor processing. These ICs enable high precision input interpretation in real time applications. Advanced Low Power Schottky (ALS/AS) logic series chips such as ALS74, ALS500 and AS74 are also incorporated in the board to manage control logic and reduce power consumption.
Connectivity of the E4809-770-018-B SVP board is provided via a gold plated edge connector for backplane integration that allows seamless connection in rack-mounted systems. The board also includes two rear 50-pin I/O ports for peripheral communication and data exchange. Power management and signal integrity are supported through TDK filtering components. These include ceramic disc and electrolytic capacitors for voltage smoothing and inductors for current control. The TDK CP-3609 filtering module ensures electromagnetic and radio frequency interference suppression. This enhances signal stability and protects connected components from noise interference.
