E4809-747-002

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The E4809-747-002 is a PCB-mounted control board designed for semiconductor equipment control. Manufactured by Okuma as part of the E4809 CNC Boards series, it features a 24 V DC input voltage and a compact size of approximately 150mm x 100mm x 30mm. This board operates within 0°C to 50°C and weighs around 250 grams.

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Product Description:

Okuma’s E4809-747-002 is a sophisticated control board from the E4809 CNC board series, designed specifically for automation systems.

Made to complement Okuma’s OSP300 CNC platform, this board plays a crucial role as a System Bus Control (SBC) console in terms of communication and coordination of subsystems in any complex machinery, particularly in the control environment of semiconductors. This E4809-747-002 operates on a stable 24 V DC input and is based around a Single Board Computer (SBC) architecture, which amalgamates processing, memory, and interface into a compact, efficient form factor. The board has a dimension of about 150 mm x 100 mm x 30 mm, and it weighs approximately 250 grams and is suitable for embedded control applications, as space and weight are factors. It has a 4-layer PCB construction, which improves signal integrity, minimizes electromagnetic interference, and allows for a stronger circuit routing. The board uses multipin connectors, either of the ribbon or edge type, for ease of and secure connection to other system components. Its mounting type is standard PCB mount, and it is easy to install either in control cabinets or embedded enclosures.

The temperature range of the board is 0°C to 50°C, which follows the industrial environment standard, and passive cooling (without a fan) means silent and maintenance-free thermal management. The E4809-747-002, conforming to the RoHS standards, is friendly to the environment and does not contain hazardous substances. The Communication is handled using a proprietary protocol designed by Tokyo Electron with compatibility to specialized industrial automation and semiconductor manufacturing systems. Its reliable operation capabilities and high processing power, together with its ability to integrate with the OSP300 system, make it an integral element of the automation and control environment of Okuma.

Board Function
System Bus Control (SBC) Console
Board Layer Count
4 Layer PCB
Communication Protocol
Proprietary (Tokyo Electron)
Compatible CNC System
OSP300
Connector Type
Multipin (Ribbon or Edge)
Cooling Method
Passive (no fan required)
Dimensions
Approx. 150mm x 100mm x 30mm
Input Voltage
24 V DC
Mounting Type
PCB Mount
Operating Temperature
0°C to 50°C
Processor Type
SBC (Single Board Computer)
Rohs Compliance
Yes
Type
Control Board
Typical Application
Semiconductor Equipment Control
Weight
Approx. 250g

Frequently Asked Questions about E4809-747-002:

Q: What is the function of the E4809-747-002 in Okuma CNC systems?

A: The E4809-747-002 functions as a System Bus Control (SBC) board, managing subsystem communication and control in CNC machines and semiconductor automation setups.

Q: What are the electrical and dimensional specs of the E4809-747-002?

A: The board operates on a 24V DC power input and measures approximately 150 mm x 100 mm x 30 mm, with a total weight of about 250 grams.

Q: What type of construction and mounting does the E4809-747-002 feature?

A: It features a 4-layer PCB design for improved signal integrity and reduced EMI, and it uses standard PCB mounting for easy integration into enclosures.

Q: What communication protocol does the E4809-747-002 support?

A: The board communicates using a proprietary protocol developed by Tokyo Electron, designed for compatibility with high-end CNC and semiconductor systems.

Q: What environmental and compliance standards does the E4809-747-002 meet?

A: It operates within a temperature range of 0°C to 50°C, uses passive cooling, and is RoHS compliant, ensuring environmentally friendly performance.


Internal Product Review

  • ‘‘The E4809-747-002 is a compact, powerful SBC-based control board built for Okuma's OSP300 platform. Its 4-layer construction, space-efficient form factor, and industrial-grade communication support make it ideal for high-end automation and semiconductor environments.’’

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