E4809-045-029-C Okuma
Wake Industrial LLC is not an authorized distributor of this product.
The E4809-045-029-C PCB features HD74LS74P dual D flip-flops and SN74LS193P 4-bit up/down counter for advanced timing and counting functions. The optimized layout ensures minimal EMI and reliable signal integrity.
Internal Product Review
The Okuma E4809-045-029-C PCB excels with its HD74LS08P quad AND gates, HD74LS85P 4-bit comparator, and SIP resistor networks for grouped resistance. Its optimized signal routing and 0.1 µF ceramic capacitors enhance noise reduction and EMI control. It is ideal for precise embedded applications.
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Product Description:
The E4809-045-029-C PCB is designed for efficient logic control and processing. It supports seamless connectivity within electronic systems using edge and ribbon connectors. The board includes active and passive components for reliable signal processing, logic operations and control functions. This PCB is ideal for embedded or modular hardware integration.
The Okuma E4809-045-029-C PCB features an edge connector for direct connection to the system’s backplane. A white plastic ribbon connector allows connection to peripheral modules. The board integrates several logic ICs to perform different logical functions. These include the HD74LS85P 4-bit magnitude comparator that is used to compare two binary values. The HD74LS08P is a quad 2 input AND gate that enables basic logic operations. The SN74LS37N triple 3 input NAND gate supports complex control logic. The SN74LS86N IC offers four 2 input XOR gates for parity and comparison tasks. The HD74LS74P contains two D type flip flops with set/reset capabilities that are used for timing and memory storage. The SN74LS193P is a 4 bit binary up/down counter essential for counting operations in logic sequences. The DM74368N is a hex inverter and tri state buffer that is used for signal direction control and bus interface. The DM8098N acts as a peripheral controller and buffer.
Passive components are also mounted in this E4809-045-029-C PCB to support signal integrity and filtering. Multiple 0.1 µF ceramic capacitors are used for decoupling and noise reduction. The resistors are present for pull up and pull-down configurations across the logic lines. The SIP (Single Inline Package) resistor networks are used for grouped resistance configurations. The board’s layout is optimized for signal trace routing and thermal performance. Components are placed to minimize cross talk and electromagnetic interference.
