E4809-045-029-C

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The E4809-045-029-C PCB features HD74LS74P dual D flip-flops and SN74LS193P 4-bit up/down counter for advanced timing and counting functions. The optimized layout ensures minimal EMI and reliable signal integrity.

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Product Description:

The E4809-045-029-C PCB is designed for efficient logic control and processing. It supports seamless connectivity within electronic systems using edge and ribbon connectors. The board includes active and passive components for reliable signal processing, logic operations and control functions. This PCB is ideal for embedded or modular hardware integration.

The Okuma E4809-045-029-C PCB features an edge connector for direct connection to the system’s backplane. A white plastic ribbon connector allows connection to peripheral modules. The board integrates several logic ICs to perform different logical functions. These include the HD74LS85P 4-bit magnitude comparator that is used to compare two binary values. The HD74LS08P is a quad 2 input AND gate that enables basic logic operations. The SN74LS37N triple 3 input NAND gate supports complex control logic. The SN74LS86N IC offers four 2 input XOR gates for parity and comparison tasks. The HD74LS74P contains two D type flip flops with set/reset capabilities that are used for timing and memory storage. The SN74LS193P is a 4 bit binary up/down counter essential for counting operations in logic sequences. The DM74368N is a hex inverter and tri state buffer that is used for signal direction control and bus interface. The DM8098N acts as a peripheral controller and buffer.

Passive components are also mounted in this E4809-045-029-C PCB to support signal integrity and filtering. Multiple 0.1 µF ceramic capacitors are used for decoupling and noise reduction. The resistors are present for pull up and pull-down configurations across the logic lines. The SIP (Single Inline Package) resistor networks are used for grouped resistance configurations. The board’s layout is optimized for signal trace routing and thermal performance. Components are placed to minimize cross talk and electromagnetic interference.

Capacitor
0.1 µF
Ceramic Capacitors
Multiple
Cross Section
5.33 mm
Hardness
75 Shore A
Hex Inverter
DM74368N
Inside Diameter
44.42 mm
Material
FKM (Viton)
Peripheral Controller
DM8098N
Resistors
Available
Temperature Range
-20°C to +200°C

Frequently Asked Questions about E4809-045-029-C:

Q: What components in the E4809-045-029-C PCB help reduce noise and improve signal quality?

A: Multiple 0.1 µF ceramic capacitors are placed for decoupling and noise suppression. Resistors and SIP resistor networks configure pull-up and pull-down circuits to stabilize logic lines.

Q: How does the E4809-045-029-C PCB ensure stable logic control in complex systems?

A: The PCB integrates ICs like the SN74LS37N triple 3-input NAND gate for advanced logic functions. Its layout minimizes cross talk and electromagnetic interference to maintain signal integrity.

Q: What role do the edge and ribbon connectors play in the Okuma E4809-045-029-C PCB?

A: The edge connector provides a direct link to the system’s backplane enabling high-speed data transfer. The white plastic ribbon connector facilitates seamless connection to peripheral modules.

Q: How does the E4809-045-029-C PCB handle timing and counting functions?

A: It uses HD74LS74P dual D-type flip flops for precise timing and memory storage. The SN74LS193P 4-bit binary up/down counter manages counting operations in sequential logic.

Q: How does the Okuma E4809-045-029-C PCB control signal direction and bus interfacing?

A: The DM74368N hex inverter and tri-state buffer manage signal direction control effectively. This supports smooth bus interfacing and prevents signal conflicts in the system.


Internal Product Review

  • ‘‘The Okuma E4809-045-029-C PCB excels with its HD74LS08P quad AND gates, HD74LS85P 4-bit comparator, and SIP resistor networks for grouped resistance. Its optimized signal routing and 0.1 µF ceramic capacitors enhance noise reduction and EMI control. It is ideal for precise embedded applications.’’

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