T003-0002

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The T003-0002 is a thermocouple sensor designed with a 3 mm stainless steel sheath and a temperature range of -50°C to 1100°C. Manufactured by Danaher as part of their Synqnet Boards series, it features a grounded junction and fiberglass insulation. It also has a 2-meter cable length and a miniature plug connector.

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Product Description:

The model T003-0002 is a PCB designed for real time signal processing tasks. It integrates a DSP, FPGA, CPLD and SRAM memory to support complex computing functions. It also includes high speed connectors and internal headers for efficient data transfer and expandability.

The T003-0002 PCB is built around the ADSP-21061L SHARC DSP (Digital Signal Processor). It features a 32 bit Super Harvard Architecture and supports floating point operations. It includes 512 K words of on chip SRAM and operates at clock speeds up to approximately 66 MHz. This processor provides the capability to handle intensive real time signal processing workloads. The board also features the Xilinx XC4044XLT-HQ208 FPGA (Field Programmable Gate Array). A high capacity logic device with 44,000 system gates. It comes in a 208 pin HQFP package and enables custom logic design and fast I/O operations. The Lattice ispLSI 2128VE-100LQ160 CPLD (Complex Programmable Logic Device) is integrated to provide further logic control with 128 I/O pins, in system programmability and a 100 MHz speed grade. Memory on the board includes the Alliance AS7C1025-12TC CMOS SRAM. This chip provides 128 K x 8 bit memory with 12 ns access time and operates at 3.3 V. It is mainly used for buffering tasks or motion data caching. The combination of these components supports advanced computational tasks and high speed logic control in embedded systems.

The Danaher T003-0002 PCB features two VHDCI 68 pin connectors on the bracket. These connectors are suited for high speed parallel or serial I/O operations. The Synqnet series board also includes a 40 pin ribbon header which supports internal bus connections, debugging or system expansion purposes. This internal header ensures easy integration with other system components or test equipment.

Cable Length
2 m
Connector Type
Miniature plug
Insulation
Fiberglass
Junction Type
Grounded
Material
Stainless Steel
Mounting Style
Compression fitting
Response Time
<5 seconds (in liquid)
Sheath Diameter
3 mm
Sheath Length
150 mm
Temperature Range
-50°C to 1100°C
Type
Thermocouple
Voltage Rating
30V max

Frequently Asked Questions about T003-0002:

Q: How does the ADSP-21061L SHARC DSP enhance the T003-0002’s real-time processing?

A: The T003-0002 PCB uses a 32-bit Super Harvard Architecture DSP. It supports floating point operations and runs at up to 66 MHz enabling intensive real-time signal processing.

Q: What role does the Xilinx XC4044XLT FPGA play in the T003-0002 PCB?

A: The FPGA provides 44,000 system gates for custom logic design. It supports fast input/output operations in a 208-pin HQFP package enhancing board flexibility and performance.

Q: Why is the Lattice ispLSI 2128VE CPLD important in the Danaher T003-0002 PCB?

A: This CPLD offers 128 I/O pins and 100 MHz speed grade. It enables in-system programmability and adds advanced logic control capabilities to the board.

Q: How does the onboard SRAM support the T003-0002’s processing functions?

A: The PCB uses 128 K x 8 bit CMOS SRAM with 12 ns access time. It operates at 3.3 volts mainly for buffering and caching motion data efficiently.

Q: What connectivity options does the Danaher T003-0002 PCB provide for system integration?

A: It features two VHDCI 68-pin connectors suited for high-speed parallel or serial I/O. The board also includes a 40-pin ribbon header for internal bus connections and debugging.


Internal Product Review

  • ‘‘The T003-0002 PCB delivers powerful real-time processing with its 66 MHz ADSP-21061L SHARC DSP, 44,000 gate Xilinx FPGA, and 128 I/O pin CPLD. Its 128Kx8 SRAM supports rapid data caching, while VHDCI connectors and ribbon header enable flexible high-speed I/O and system expansion. This model excels in complex embedded applications.’’

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