XTL-HL Copley Controls
Wake Industrial LLC is not an authorized distributor of this product.
The Copley Controls XTL-HL is a low-profile heatsink accessory from the Copley Controls Accessories series, designed for field installation. It weighs 1.26 lb (0.57 kg) and includes eight 0.160 inch (4.1 mm) mounting holes for #6-32 (M3.5) screws. The heatsink is 0.88 inches (22.4 mm) high and comes with two protective sheets and a dry-film interface pad, requiring no thermal grease.
Internal Product Review
The XTL-HL is a low-profile heatsink accessory designed for field installation in Copley Controls systems. The dry-film interface pad and no thermal grease requirement simplify assembly while supporting efficient thermal management, making this heatsink a very practical cooling accessory.
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Product Description:
The XTL-HL is a low-profile heat sink supplied by Copley Controls within the Copley Controls Accessories series. It provides supplementary thermal dissipation for the manufacturer’s servo amplifiers and similar motion-control modules used in industrial automation cabinets. By increasing the available surface area while fitting into restricted enclosures, the unit helps maintain safe component temperatures without requiring an active airflow device. Its compact form also leaves more room for nearby wiring, connectors, and other cabinet components.
The heat sink weighs 1.26 lb (0.57 kg), allowing the additional static load on DIN rails or backplates to be calculated accurately. It has eight mounting apertures measuring 0.160 in (4.1 mm) each, providing even clamping force across the base when the fasteners are tightened. The holes accept #6-32 (M3.5) machine screws, which are commonly used for mounting components in control cabinets. Overall thickness is limited to 0.88 in (22.4 mm), allowing the assembly to clear adjacent wiring ducts and other closely spaced equipment. The low-profile housing minimizes airflow obstruction while still providing sufficient fin area for passive heat dissipation. The mounting pattern aligns the heat sink with compatible amplifier footprints without requiring additional brackets.
The accessory is intended for field installation, and its hardware and alignment features support straightforward assembly at the installation site. Heat transfer between the drive and heat sink is handled by a factory-applied dry-film interface pad, which creates a consistent thermal path between the contacting surfaces. The interface requires no additional thermal compound, reducing residue and cleanup during future maintenance. The pad is protected by two removable slip-on films that shield its contact surfaces from dust and contamination before assembly. Both protective layers should be removed immediately before the heat sink is fastened to the drive. The design relies entirely on passive convection and does not include a fan, eliminating fan noise and moving components. After fastening, the dry-film interface maintains uniform contact pressure across the mating surface to support consistent heat transfer during operation.
