Product Description:

The CSB01.1C-S3-ENS-EN2-L2-S-NN-FW drive controller module is produced by Bosch Rexroth Indramat for the CSB Drive Controllers series. Installed in multi-axis servo cabinets, it processes command, feedback, and local I/O signals while linking motion hardware to higher-level automation through deterministic network traffic. By supervising encoder channels, managing user inputs, and coordinating with an associated power section, it functions as the central interface for motor torque and position control in industrial automation. This arrangement allows the control section to exchange status, motion data, and interlock signals without requiring separate interface hardware at every axis.

On the control side, communication with the PLC network runs over Sercos III, enabling cyclic position and parameter exchange. The controller operates from DC 19 to 30 V, and each output can supply 24 V at 0.5 A to contactors or optical sensors. Local signal capacity includes 3 combined I/O channels and 5 dedicated digital inputs for fast edge capture or drive-enable logic. Two probe inputs support latch functions, and one relay contact rated at DC 24 V, 1 A provides isolated switching for external interlocks. Encoder Interface 1 handles IndraDyn, HIPERFACE, 1 Vpp, and TTL feedback, while Interface 2 accepts EnDat 2.1, 1 Vpp, or 5 V TTL. The ENS rail supplies 12 V and the EN2 rail supplies 5 V to connected transducers.

In safety-critical machinery, the unit implements Safe Torque Off with certified integrity to SIL3 / Cat. 3 PL e, allowing energy to be removed from the motor phases without additional contactors. The compact mechanical layout fits cabinet installations where control hardware must remain close to the power section and feedback cabling. The board set fits within a 49.5 mm wide carrier, extends 103 mm deep, and rises 241 mm high to align with the standard power section profile. Dual encoder supplies, two probe channels, and the relay interface support high-resolution feedback handling while keeping the module footprint compact.