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EP-58MVP3C-M Beckhoff

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The EP-58MVP3C-M is a Beckhoff motherboard from the EP Digital Input Modules series, featuring a VIA Apollo MVP3 AGP/PCIset chipset and a Socket 7 CPU socket. It supports up to 384 MB of memory across 3 DIMM slots and includes 3 ISA, 4 PCI, and 1 AGP expansion slots. The board size is 220 x 260 mm and it offers IDE support for up to four Ultra DMA/33 devices.

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Product Description:

The EP-58MVP3C-M is a circuit board in Beckhoff's EP Digital Input Modules series. Within an automation cabinet, it functions as an interface that digitizes incoming 24 V switch or sensor states and routes them to a PC-based controller, allowing deterministic acquisition of machine status data. Its layout follows a standard ATX form factor so it can be installed alongside other Beckhoff EP modules, creating a modular platform for distributed I/O where high-density discrete inputs must be tied into supervisory controllers.

Measuring 220 x 260 mm, the board provides space for the VIA Apollo MVP3 AGP/PCIset chipset that coordinates memory, IDE, and peripheral buses. The front-side bus can be selected at 60/66/75/83/100 MHz, while the processor interface uses the legacy Socket 7 format with jumper-selectable multipliers from 2x through 5x. Vcore options from 2.1 V up to 3.2 V allow matching to low-power or higher-draw CPUs. A 512 KB Pipelined Burst SRAM cache reduces main-memory fetch cycles, and three 168-pin DIMM sockets accept up to 384 MB of SDRAM. Signal integrity across the backplane is maintained by a four-layer PCB that dedicates continuous planes to ground and power.

For local expansion, the module offers 3 ISA, 4 PCI, 1 AGP expansion slots, so proprietary Beckhoff adapter cards or standard PC boards can be added without an external chassis. Two IDE channels permit connection of up to four devices, and data bursts are supported in Ultra DMA/33 transfer mode for rapid retentive logging of input events. A single USB header simplifies service data transfers, while the always-on 5 V standby rail must supply 0.1 A to preserve BIOS settings during power-down. The board's IDE timing, cache, and FSB selections are all jumper configurable, allowing consistent latency tuning when the module is integrated into larger EtherCAT or fieldbus architectures.

Atx 5vsb Min
0.1 A
Board Size
220 x 260 mm
Bus Clock Options
60/66/75/83/100 MHz
Chipset
VIA Apollo MVP3 AGP/PCIset
Cpu Multipliers
2x/2.5x/3x/3.5x/4x/4.5x/5x
Cpu Socket
Socket 7
Cpu Vcore Options
2.1/2.2/2.8/2.9/3.2 V
Expansion slots
3 ISA, 4 PCI, 1 AGP
Ide Channels
2
L2 Cache
512 KB Pipelined Burst SRAM
Max Ide Devices
4
Max Ide Mode
Ultra DMA/33
Max Memory
384 MB
Memory Slots
3 x 168-pin DIMM
Pcb Layers
4
Usb Connectors
1

Frequently Asked Questions about EP-58MVP3C-M:

Q: What type of CPU socket does the EP-58MVP3C-M provide?

A: The EP-58MVP3C-M motherboard features a Socket 7 CPU socket, supporting a variety of compatible processors.

Q: What is the maximum memory capacity and configuration of the EP-58MVP3C-M?

A: This model supports up to 384 MB of RAM through three 168-pin DIMM memory slots.

Q: What expansion options are available on the EP-58MVP3C-M?

A: The expansion slots include 3 ISA, 4 PCI, and 1 AGP slot, allowing for various peripheral installations.

Q: How many IDE devices can the EP-58MVP3C-M support and at what maximum mode?

A: There are two IDE channels that support up to four IDE devices with Ultra DMA/33 mode.

Q: Which chipset is featured on the EP-58MVP3C-M motherboard?

A: The EP-58MVP3C-M uses a VIA Apollo MVP3 AGP/PCIset chipset for system management and connectivity.


Internal Product Review

  • ‘‘The EP-58MVP3C-M is an industrial motherboard built on the VIA Apollo MVP3 AGP/PCIset with a Socket 7 CPU interface. Support for up to 384 MB across 3 x 168-pin DIMM slots gives the platform useful memory flexibility for legacy control builds. The 3 ISA, 4 PCI, and 1 AGP expansion layout is a major advantage for integration-heavy retrofit applications.’’

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