CB3064-0002 Beckhoff
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The CB3064-0002 is a modular motherboard manufactured by Beckhoff and is part of the CB Modular Motherboards series. It features dual LAN ports with Intel i219 and Intel i210 controllers, supports up to 32 GB DDR4-2133 memory through two SO-DIMM sockets, and provides four SATA ports at 6 Gb/s. The board measures 102 x 147 mm and includes 11 USB channels and 8 GPIOs.
Internal Product Review
The CB3064-0002 is a Beckhoff modular motherboard with support for up to 32 GB of DDR4-2133 memory. Dual Intel i219 and Intel i210 LAN controllers give the board strong networking capability for demanding control architectures. Four SATA ports with 6 Gb/s transfer support make this model especially appealing for storage-intensive industrial builds.
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Product Description:
The CB3064-0002 is a modular industrial motherboard manufactured by Beckhoff within the CB Modular Motherboards series. It forms the embedded core of machine controllers by delivering processor, memory, and communication subsystems on a small form factor that fits tightly in electrical enclosures. When integrated with Beckhoff runtime software, the board allows real-time motion, I/O scanning, and data logging to occur on the same hardware that hosts user interfaces and network services.
The board footprint measures 102 x 147 mm, enabling installation on DIN-rail carrier plates or within confined panel spaces. Two SO-DIMM260 sockets accept up to 32 GB of RAM, and operation at DDR4-2133 speeds supports multi-axis interpolation and database tasks. Four SATA connectors sustain 6 Gb/s transfers for SSD or RAID devices, while the power domain is supplied through a 2x10-pin header that forwards ATX voltage rails. Eight GPIO lines provide simple sensor or handshake signaling. Integrated Intel i219 and i210 controllers feed 2 independent Gigabit LAN channels, separating field traffic from supervisory data.
Firmware initialization is handled by the AMI Aptio V BIOS, giving UEFI boot and secure update functions. Two high-density 2x40-pin PCIe expansion headers expose four Gen3 lanes each so motion coprocessors or fieldbus cards can be added without risers. The processor package may operate reliably up to 100 °C die temperature, an advantage in fanless cabinets that rely solely on conduction cooling. Eleven USB channels, including four USB 3.0 and seven USB 2.0, are routed through internal and rear-panel headers; the figure of 11 allows simultaneous attachment of HMI touchscreens, service sticks, and vision cameras. The layout supports storage, networking, and peripheral expansion on one compact control board.
