CB3050-0008 Beckhoff
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The Beckhoff CB3050-0008 is part of the CB Modular Motherboards series and features an Intel 855GME and Intel ICH4 chipset. It is equipped with six USB 2.0 ports, four serial ports, and supports both DVI-I and LVDS connectors. The motherboard provides Ethernet ports for 10/100BaseT and 10/100/1000BaseT connections, and measures 102 x 147 millimeters.
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Product Description:
The CB3050-0008 modular motherboard is built by Beckhoff as a member of the CB Modular Motherboards series. It forms the computing core for embedded controllers that coordinate motion, safety, and visualization functions in automated machinery. By combining industrial-temperature components with a compact layout, the board lets OEMs place PC-based control directly inside panels or decentralized cabinets while meeting the reliability expectations of factory environments. Its mix of fieldbus, video, and storage interfaces minimizes the need for additional expansion cards.
The board measures 102 x 147 mm, which matches 3.5-inch carrier frames used for DIN-rail mounting. Processing resources come from the Intel 855GME + Intel ICH4 chipset, which supports DDR memory, ATA-100 disk control, and a 533 MHz front-side bus for mobile Pentium M CPUs. The platform draws from a regulated 5 V ±5% backplane, while a dedicated header supplies the cooling fan with 12 V. Onboard networking uses a Fast Ethernet PHY and a Gigabit MAC through a combined RJ45 block that provides 1x 10/100BaseT + 1x 10/100/1000BaseT. External peripherals connect through 6 x USB 2.0 ports, and each port can supply up to 500 mA. Two 2×22-pin IDE sockets accept parallel ATA drives, and the Intel 82562 and 82541ER controllers handle deterministic Ethernet traffic for fieldbus protocols.
Video output supports both legacy and flat-panel displays. An integrated controller routes analog and digital signals through a DVI-I connector, and a separate low-voltage differential signaling path is available on a 30-pin LVDS header for direct connection to TFT panels in operator terminals. The silicon is specified for junction temperatures up to 100 °C, so continuous duty inside sealed machines is permitted when the cooling guidelines are followed. This arrangement allows the motherboard to support either an external monitor or an integrated display from the same platform.
