CB3050-0003 Beckhoff
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The Beckhoff CB3050-0003 is part of the CB Modular Motherboards series and supports a maximum memory of 2 GB DDR-333 SO-DIMM200. It features six USB ports, four serial ports, one mini-PCI slot, and two IDE channels. The motherboard includes AC97 audio, DVI-I connector, and can handle LAN speeds up to 10/100/1000BaseT.
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Product Description:
The CB3050-0003 is a modular motherboard manufactured by Beckhoff within the CB Modular Motherboards series. It forms the computing core of panel PCs and embedded controllers used in automated production lines, combining processor, memory, and interface logic on a single card. By supplying fieldbus, storage, and video connectors in a compact layout, the board gives machine builders a ready-to-integrate platform for real-time control tasks inside DIN-rail or enclosure-mounted systems.
Its compact outline of 102 mm x 147 mm conserves cabinet space yet leaves clearance for mezzanine cards. One SO-DIMM socket accepts DDR-333 SO-DIMM200 modules, and capacity tops out at 2 GB, providing predictable access times for deterministic motion loops. Two IDE channels allow separate hard-drive and optical media attachment, while a single mini-PCI slot supports wireless or auxiliary fieldbus cards. Integrated ECC support detects single-bit memory faults during continuous duty cycles. Dual Ethernet controllers provide 10/100 + 10/100/1000BaseT links for segmented networks, and the board includes 4 serial ports for legacy drives, scanners, or PLC bridges. An LVDS interface drives 18- or 24-bit TFT panels directly, giving flexible display cabling options.
For cabinet wiring, the board requires a 5 V ±5% supply with 5 VSB and a 12 V fan output, eliminating extra rails in compact enclosures. Audio output follows the AC97 standard, and a DVI-I connector supports digital or analog monitors on the factory floor. The board has 6 USB ports, and each port can deliver 500 mA for data keys, cameras, or service tools without external hubs. The controller layer also supports 4/5-wire resistive touchscreens for operator panels. A maximum die temperature of 100 °C guides enclosure cooling design, helping maintain reliable operation as heat moves away from high-load components.