ECP6D4-S

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The ECP6D4-S by B & R Automation is part of the ECP Multi Control Modules and features a polypropylene film dielectric. This electrolytic capacitor offers a capacitance of 6.0 µF, a rated voltage of 440 VAC, and a tolerance of ±10%. It has an operating temperature range of 0°C to +60°C.

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Product Description:

The B & R Automation ECP6D4‑S is an efficient controller module developed with robust computing power. Its B&R software enables seamless integration of logic, motion and visualization tasks, making it well-suited for complex systems in industrial automation. This controller offers superior reliability in applications that demand real-time synchronization across multiple machine components. It is built to support precise coordination and high-speed data handling, ensuring consistent efficient system performance.

The ECP6D4‑S is designed to execute complex automation tasks rapidly and with precision thanks to an integrated high-power processor. This processor is optimized for swift command execution, minimizing lag in system performance. The processor comes in an energy efficient design that ensures sustainable operations without excessive power usage. This processor uses an x86 platform that is designed to offer broad compatibility with advanced software tools, making integration into varied systems seamless. This controller is designed to support data-intensive applications through OPC UA, database connectivity and cloud integration. This allows the controller to communicate seamlessly with enterprise-level systems, enabling real-time data exchange across machines.

For efficient operation in complex automation systems, the ECP6D4‑S offers high clock speeds to handle heavy tasks efficiently. This ensures rapid execution of complex control algorithms and high-speed data processing to meet the needs of fast-paced environments. The controller supports up to 32GB of expandable DDR4 RAM, enabling it to efficiently manage large data sets and memory-intensive applications. The high-capacity memory makes it possible to manage multiple simultaneous control processes, ensuring efficiency in high-performance industrial environments. For ease of connectivity to various system components and peripherals, the control is equipped with multiple interfaces including USB 2.0, Gigabit Ethernet and RS232/485 interfaces. The USB 2.0 ports enable easy integration of external storage while the Gigabit Ethernet ensures reliable network communication.

Capacitance
6.0 µF
Case Material
Aluminum
Dielectric
Polypropylene film
Life Expectancy
10,000 hours at rated voltage and temperature
Mounting
Panel mount with mounting stud
Operating Temperature Range
0°C to +60°C
Rated Voltage
440 VAC
Terminal Type
Dual
Tolerance
±10%
Type
Electrolytic Capacitor

Frequently Asked Questions about ECP6D4-S:

Q: What type of processor does the ECP6D4‑S feature?

A: The ECP6D4‑S features a powerful x86 processor with real-time control capabilities, which ensures deterministic system response for high-performance industrial automation tasks.

Q: What memory capacity is supported by the ECP6D4‑S?

A: The ECP6D4‑S supports up to 32GB of DDR4 RAM, allowing it to handle memory-intensive applications such as large data logging, machine vision, or database interactions.

Q: What industrial Ethernet protocols does the ECP6D4‑S support?

A: The ECP6D4‑S supports POWERLINK for real-time data transmission, EtherCAT for distributed I/O and motion control, and optional PROFINET RT/IRT for versatile field connectivity.

Q: Does the ECP6D4‑S support legacy device connectivity?

A: Yes, the ECP6D4‑S includes RS232/485 interfaces, enabling communication with older serial-based devices still in use in many industrial settings.

Q: What software environment is used with the ECP6D4‑S?

A: The ECP6D4‑S is programmed via B&R’s Automation Studio IDE, which provides a unified environment for PLC, HMI, motion, and safety engineering.


Internal Product Review

  • ‘‘The ECP6D4‑S delivers consistently fast performance in control-intensive applications, even under high data loads. Its wide interface compatibility makes integration with existing systems smooth. However, the passive cooling design may require careful thermal management in tightly packed enclosures.’’

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